EMS's Clad-Shield™ Materials
for complete protection from low and high-range EMI and RF waves

EMS Clad-Shield Material

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Want to hear more about how EMS’s unique blend of copper and alloy 49 provides a full-range of protection from both low and high frequencies? Email us today!

Contact us right here: solutions@emsclad.com

Shielding against EMI and RFI waves is becoming a growing concern in countless industries. 

Whether it’s from EMI blasts in military drones or complete room coverage from electrical interference, our Clad-Shield™ material is unique in the market as it blocks both high and low range EMI and RFI waves. 

Complete EMI protection from a single product is incredibly rare. Clad-Shield attenuates both magnetic and electric fields, meaning it has limitless possible use-cases. 

Clad-Shield Benefits

With EMS’s Clad-Shield, you can do more with less, unlocking untapped potential and design innovation with the increased free space and decreased weight.

High performance across broad frequencies

Clad-Shield combines a high-permeability path for low-frequency magnetic fields with a high-conductivity path for mid to high frequencies, so one construction addresses both H-field and E-field interference.

Lightweight construction

Thin laminated layers deliver shielding effectiveness with far less mass than solid steel solutions, important for SWaP-constrained systems.

Wide dynamic range

Layering strategies limit premature magnetic saturation and maintain effectiveness over a broad span of field strengths.

Low sensitivity to stress

Clad stacks distribute mechanical strain during cutting and forming, stabilizing permeability compared to single-alloy foils that can lose performance after fabrication.

Solderability and formability

Solderable outer surfaces simplify bonding and grounding. Thin gauge material forms easily into cans, covers, and gaskets for enclosure-level integration.

High performance across broad frequencies

Clad-Shield delivers broadband attenuation of both magnetic and electric fields, so one material can address low-frequency H-fields and higher-frequency E-fields in compact assemblies.

Technical notes:

  • Composite construction pairs a high-permeability layer for magnetic absorption with a highly conductive layer for reflection and surface current return, enabling near-field magnetic and far-field electric shielding in one stack.
  • Effective shielding depends on wave impedance and frequency. High-µ layers dominate at low frequencies and in the magnetic near field, while conductivity and skin effect dominate at higher frequencies.

Lightweight construction

High shielding effectiveness at a fraction of the mass of solid steel solutions, enabling weight-critical designs.

Technical notes:

  • Laminated shielding foils and laminates achieve high effectiveness with very thin metal layers, which reduces mass and simplifies integration in enclosures, cables, and panels.

Wide dynamic range

Stable shielding performance across a wide range of field strengths, helping prevent rapid roll-off as fields increase.

Technical notes:

  • Multi-layer shields can combine a high-saturation ferromagnetic layer with a high-permeability layer. The outer, higher-Bs layer reduces the incident field so the inner high-µ layer does not saturate as quickly, extending useful operating range.

  • Saturation and dynamic behavior are governed by the permeability and saturation flux density of the magnetic layer; representative high-µ alloys have very high µ but lower saturation than steels, which is why stacking strategies matter.

Low sensitivity to stress

Designed for stable performance after typical fabrication and assembly operations such as cutting, bending, and fastening.

Technical notes:

  • Monolithic high-permeability foils are well known to lose permeability when mechanically stressed and often require post-forming anneal to recover performance. Clad constructions can mitigate performance drift by distributing strain and protecting the magnetic layer.

Solderability and formability

Solderable outer surfaces and good formability simplify enclosure design, grounding, and assembly.

Technical notes:

  • Copper and tin-plated copper surfaces are readily solderable and commonly used on EMI shields; tin plating resists oxidation and facilitates soldering during assembly.

  • Shielding laminates are flexible and easy to cut or form, which reduces time from prototype to production enclosure.

How Clad-Shield Works

With Clad-Shield, you get the benefits of both materials, offering two key mechanisms that complement each other perfectly. 

Two complementary mechanisms

1 Magnetic absorption at low frequencies and in the magnetic near field

A high-permeability layer provides a low-reluctance path, pulling flux into the shield and away from sensitive circuitry.

2 Conductive reflection at mid to high frequencies

 A highly conductive layer supports induced surface currents that create opposing fields, reflecting incident energy. As frequency rises, skin depth decreases and reflection dominates.

Why this matters

Wave impedance and distance from the source determine whether the disturbance behaves like a magnetic field, an electric field, or a plane wave. Clad-Shield’s paired properties let a single material cover multiple regimes without changing materials or adding parts.

Frequency vs. Shielding Mechanism

Understanding how electromagnetic interference behaves across different frequency ranges is critical to designing effective shielding for your unique application.


The chart below breaks down the dominant field regimes from DC through the gigahertz range, the shielding mechanisms that apply, and the material attributes that matter most at each stage.

 

Frequency band

Dominant field regime

Primary mechanism

Material attributes to prioritize

Design guidance

DC to ~60 Hz

Magnetic near field

Magnetic absorption, flux rerouting

Very high permeability, adequate resistivity

Provide a continuous low-reluctance path around the protected volume. Avoid gaps at seams.

~60 Hz to ~2 kHz

Magnetic near field, increasing eddy effects

Absorption, impedance coupling into magnetic layer

High permeability with narrow hysteresis, stable after forming

Maximize coupling area to the magnetic layer. Ensure good mechanical support to limit stress-induced µ loss.

~2 kHz to ~50 kHz

Transition region

Absorption plus reflection (eddy currents become significant)

Ferromagnetic properties with rising conductivity

Combine high-µ layer with a conductive layer. Maintain electrical continuity for current return.

~50 kHz to ~1 GHz

Electric field and plane-wave behavior increases

Conductive reflection via surface currents

High conductivity, continuous grounding, low joint resistance

Emphasize seam integrity, overlaps, and gasketing. Minimize slot lengths relative to wavelength.

>1 GHz

Plane-wave, shallow skin depth

Reflection with specialized loss media as needed

Very high conductivity; optional absorbers or graded-resistance media

Consider absorber foams, pyramids, or resistive sheets where conductive shielding alone is insufficient.

Want to learn more?

The opportunities at your fingertips with EMS’s Clad-Shield material are limitless, offering reliable EMI/RFI protection across frequencies that few single materials can match.

When you’re looking for more protection, flexible design opportunities, and lower weight, we have exactly what you need. 

Click the link below and download your free EMS Clad-Shield™ Guide!

Ready to take the next step?

Interested in samples? Want to discuss a prototype? EMS Engineers are on standby to help you find the perfect solution for your unique application. Email us today and let’s get started making something special!

Contact us right here: solutions@emsclad.com

Download

Clad-Shield™ Guide

Contact us for more Information

North America
Josh Hines
Product Manager
Snap Disc Bimetal
North America
Vladimir Simkhovich
Product Manager
Electrical Grade Thermostatic Bimetal
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C.W, Kong- Wickeder Group Asia
General Manager
Thermostatic Bimetal
Europe
James Craggs
European Business Manager
Thermostatic Bimetal